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Skip to Content Japanese English Chinese About RIETI Site Map Help Contact Discussion Papers Search Site Search Menu Research Areas Research Programs (FY2024-2028) Research Programs (FY2020-2023) Research Programs (FY2016-2019) Research Programs (FY2011-2015) Policy Research Domains (FY2006-2010) Projects Survey Fellows According to Title Alphabetical order RIETI Alumni Research/Policy Papers Discussion Papers (English) Discussion Papers (Japanese) Policy Discussion Papers (English) Policy Discussion Papers (Japanese) Technical Papers (English) Technical Papers (Japanese) Non Technical Summaries List of Articles in Journals Research Digest Discussion Papers Search Publications RIETI Books (English) RIETI Books (Japanese) History of Japan's Trade and Industry Policy Authors' Words Other Publications (English) Other Publications (Japanese) Events Symposiums Workshops BBL Seminars Archived Seminar Series Data JIP Database R-JIP Database CIP Database Industry-Specific Nominal and Real Effective Exchange Rates AMU and AMU Deviation Indicators JSTAR RIETI-TID RIETI FDI Database ICPA Project Links Articles Column Special Series Newspapers & Magazines Fellows' Works VoxEU Column From IZA Perspectives from Around the World Other Contents RIETI Report Policy Update Keizai Sangyo Journal (METI Journal) Research Areas Fellows Research/Policy Papers Publications Events Data Articles Site Map Technical Issues Coontact Discussion Papers Search Close HomeFellowsAccording to Title SATO Yukihiro Print SATO Yukihiro Consulting Fellow Deputy Director, Welfare Planning Office, Minister's Secretariat, Ministry of Economy, Trade and Industry (METI), Government of Japan Expertise Science and Technology, Innovation, Science Advisory System, Information Industry, Technology Diffusion Education 2023 Master of Philosophy in Industrial Systems Manufacture and Management, University of Cambridge, UK 2022 Master of Public Administration in Science, Engineering and Public Policy, University College London, UK 2012 Master of Engineering, Osaka University 2010 Bachelor of Engineering, Osaka University Experience 2023 Deputy Director, Welfare Planning Office, Minister's Secretariat, METI 2020 Deputy Director, Policy Planning and Research Office, Trade Policy Bureau, METI 2017 Director, Regional Revitalisation Promotion Office, City of Kitakyushu 2016 Deputy Director, Nuclear Accident Response Office, Electricity and Gas Industry Department, METI 2015 Assistant Director, Human Resources Policy Office, Economic and Industrial Policy Bureau, METI 2013 Assistant Director, Fukushima Bureau of Reconstruction, Reconstruction Agency 2012 Industrial Science and Technology Policy and Environment Bureau, METI Selected Publications and Papers Sato, Y. and Arimoto, T. (2023) ‘Industrial Innovation Policy: Challenges and opportunities’, Cambridge Babbage Forum, pp. 1–18. Available at: https://ciip-group.org/media/uploads/files/Japan_Final.pdf Sato, Y. and Goenka, A. (2023) ‘How can SMEs play a greater role in tech adoption?’, Cambridge Industrial Innovation Policy. Available at: https://www.ciip.group.cam.ac.uk/reports-and-articles/how-can-smes-play-greater-role-tech-adoption/ Sato, Y. (2017) ‘Countermeasures against contaminated water at the Fukushima Daiichi Nuclear Power Plant’, Japan Industrial Publishing, 59 (1), pp. 1–4. Yoneta, K., Sato, R., Iwata, Y., Atsumi, K., Okamoto, K., Sato, Y. and Shigemoto, T. (2014) ‘Study of extreme low temperature and load solid-phase Sn-Ag system bonding mechanism for 3D ICs’, 2014 IEEE 64th Electronic Components and Technology Conference, Orlando, FL, USA, 2014, pp. 2227-2230, doi: 10.1109/ECTC.2014.6897612. Yoneta, K., Sato, R., Iwata, Y., Atsumi, K., Okamoto, K., and Sato, Y. (2013) ‘Study of low load and temperature, high heat-resistant solid-phase Sn-Ag bonding with formation of Ag3Sn intermetallic compound via nanoscale thin film control for wafer-level 3D-stacking for 3D LSI’, 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, USA, 2013, pp. 2381-2384, doi: 10.1109/ECTC.2013.6575918. Yoneta, K., Sato, R., Iwata, Y., Atsumi, K., Okamoto, K., and Sato, Y. (2013) ‘Study of low load and temperature solid-phase Sn-Ag bonding with formation of high heat-resistant Ag3Sn intermetallic compound via nanoscale thin film control for wafer-level 3D-stacking for 3D LSI’, International Conference on Electronics Packaging, Osaka, Japan, 2013, pp. FA2-1. Sato, Y., Sato, R., Iwata, Y., Morinaga, E., Oka, Y., Yoneta, K., & Ota, T. (2012) ‘Study on micro-bonding method with temperature hierarchy for next-generation 3D-SiP’, Symposium on Microjoining and Assembly Technology in Electronics, 18th, pp. 33–38. Sato, R., Tsukada, A., Sato, Y., Iwata, Y., Murata, H., Sekine, S., Kimura, R., and Kishi, K. (2012) ‘Study on high performance and productivity of TSV’s with new filling method and alloy for advanced 3D-SiP’, 2011 IEEE International 3D Systems Integration Conference, Osaka, Japan, 2012, pp. 1-4, doi: 10.1109/3DIC.2012.6262946. Tsukada, A., Sato, R., Sekine, S., Kimura, R., Kishi, K., Sato, Y., Iwata, Y., & Murata, H. (2011) ‘Study on TSV with new filling method and alloy for advanced 3D-SiP’, 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, USA, 2011, pp. 1981-1986, doi: 10.1109/ECTC.2011.5898788. Sato, Y., Sato, R., Iwata, Y., Miyagawa, H., & Murata, H. (2010) ‘Basic study on micro-bonding method with temperature hierarchy for 3D-SiP’, Japan Welding Society, pp. 160-161, doi: 10.14920/jwstaikai.2010f.0.160.0. 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